Applies sealant on a substrate in a nitrogen atmosphere, performs drop filling of chemicals or sticks
desiccating agent, aligns opposed substrates and bonds them

- High precision vacuum bonding
Utilizes our know-how in LCD panel manufacturing equipment; the state-of-the-art in vacuum technology
- Supports various processes
Wide range of use, from R&D to production. Various options allow specifications to be configured to best fit the customer's process
| Substrate dimensions |
Max. 370mm×470mm |
| Oxygen content, moisture content |
1ppm or less (for both) |
| Accuracy of alignment |
±2µm |