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About Shibaura MechatronicsInvestor RelationsProducts Social and Environmental
Activities About Shibaura Mechatronics Investor RelationsProducts Social and Environmental
Activities
About Shibaura MechatronicsInvestor Relations Products Social and Environmental
Activities
Home > Products > Vacuum Equipment > Vacuum bonding equipment
Designed for glass substrates, wafers, OLED panels, LCD panels, optical pick-up lens, LPF for digital cameras, etc.
Bubble-free bonding of glass substrates by uniform spin coating of adhesives and bonding in vacuum chamber
- Bubble-free vacuum bonding
- Continuous bonding of up to five sets of substrates
- Switch between double- and single-sided adhesive application
- Supports various substrate shapes (refer to specifications)
- Various conditions can be set to assure uniform film thickness after bonding
| Substrate thickness to be bonded | MAX.10mm | |
|---|---|---|
| Substrate to be handled |
Thickness | 0.2mm to 2.0mm |
| Size | Circular: Φ28mm to Φ100mm Rectangular:□22mm to □100mm |
|
| Bonding capacity | 10 sec./substrates set | |
| Equipment Dimensions | 1560W×800D×1200H | |
