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About Shibaura MechatronicsInvestor RelationsProducts Social and Environmental
Activities About Shibaura Mechatronics Investor RelationsProducts Social and Environmental
Activities
About Shibaura MechatronicsInvestor Relations Products Social and Environmental
Activities
Home > Products > Vacuum Equipment > Vacuum
Coating Equipment for Semiconductors and Electronic Components
High vacuum coating equipment developed for thick film formation in semiconductor manufacturing
- Thick film formation
Forms a thick film of 10 to 30µm by switching eight pairs of resistance heating evaporation sources - High efficiency vacuum coating
Achieves film forming efficiency of 34% with tri-axial rotating film-forming method (planetary dome type) and our simulation technology (film forming efficiency = mass of film/charge amount) - Space saving
Compact design reduces footprint to 70% that of our previous product
Minimizes use of clean room space by separating the front door (operation panel) with partition.
| Vacuum characteristics | Ultimate pressure | 2×10-5 Pa or less |
|---|---|---|
| Exhaust time | Within 18min to 4×10-4 Pa | |
| Outgas release | 4×10-6 Pa•m3/s | |
| Production capacity (Throughput) |
Planetary dome × 3 | |
| 4" silicon wafer | 42 wafers/batch (14 wafers/dome×3 domes) | |
| 5" silicon wafer | 24 wafers/batch (8 wafers/dome×3 domes) | |
| 6" silicon wafer | 18 wafers/batch (6 wafers/dome×3 domes) | |
| Evaporating characteristics |
Film thickness distribution | Within ±5% |
| Evaporating source | Resistance heating evaporating source: 8 units | |
| Evaporator power supply | 10V 1000A | |
