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About Shibaura MechatronicsInvestor RelationsProducts Social and Environmental
Activities About Shibaura Mechatronics Investor RelationsProducts Social and Environmental
Activities
About Shibaura MechatronicsInvestor Relations Products Social and Environmental
Activities
Home > Products > Vacuum Equipment > Low Temperature Multi-Layer Sputtering
Equipment
Best suited to form back face electrodes on discrete devices
- Applicable to lapping wafer (t 100µm)
- Can set up to seven different types of target metal
- Fully automated cassette to cassette transfer
- Color TFT touch panel display for easy operation
- CUP-GUN achieves less damage in oxidation film removal
- Supports ferromagnetic targets
- Simultaneous sputtering (with additional DC power supply)
- For forming oxidation film
| Equipment | CCS-1401 | CCS-1601 |
|---|---|---|
| Sputtering method | Magnetron down sputtering | |
| Wafer size | 5in (4in) | 6in (5in) |
| Sputtering source | Model P-GUN125RD (Φ5in×2) ×7 | |
| Sputtering power supply | DC: 6kW×2 (6kW×4) | |
| Ion etching | RF: 1kW×1 | |
| Main pump | Cryo pump | |
| Coating uniformity | ≤±10% | ≤±10% |
| Ultimate pressure (S/C) | 8×10-5 Pa | |
