M-600 High-Speed, Single-Wafer Sputtering Equipment

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Multi-purpose, single-wafer sputtering equipment based on the single-wafer sputtering technology nurtured in developing sputtering equipment for discs.
This equipment is best suited for single layer sputtering for automobile mirrors, vanity mirrors, glass master discs and electronic components.

Single-wafer load lock sputtering equipment
Realizes high throughput by minimum capacity load lock
Supports various sized substrates, up to Φ250×20h
Equipped with an automatic substrate carrier mechanism
Quick target replacement owing to indirect cooled sputtering source with large size of Φ300
Forms highly uniform film
Space saving small main unit with a footprint of 0.8×0.9m
High speed starting time turbo molecular pump

Exhaust system	Turbo molecular pump
Sputtering characteristics	Substrate dimensions	Φ250×20D (max.)
	Film thickness distribution	Within 5% (within Φ200)
	Sputtering source	Φ300 magnetron sputtering source (DC 20kW)
	Target	Cr, Al, Ag, Au, Ni, Ti, etc
Tact time	6sec/wafer (for Cr film with 50nm thickness)
Carrier system	Swing arm type (automatic)