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About Shibaura MechatronicsInvestor RelationsProducts Social and Environmental
Activities About Shibaura Mechatronics Investor RelationsProducts Social and Environmental
Activities
About Shibaura MechatronicsInvestor Relations Products Social and Environmental
Activities
Home > Products > Vacuum Equipment > Sputtering
Equipment for Research and Development
Load lock type and batch process type sputtering equipment with high-level specifications and wide
variety of options.
These two types of sputtering equipment can be used for R&D and for multi-product production.
- Sputtering source achieves uniform film thickness distribution over a wide area. (±5% (SiO2) in 170mm diameter)
- Affordable price for high-level specifications and range of options
- Forms film at both high and low temperatures
- Design concept of easy operation and maintenance
- Clean side sputtering and load lock chamber
- Space saving, compact equipment
| CFS-4EP-LL<i-miller> | CFS-4ES-231 | |
| L / L type | Batch type | |
| Sputtering method |
Side sputtering | Side sputtering |
| Sputtering source |
Φ3in×3 (4) | Φ3in×3 |
| Holder size | Φ200 | Φ200 |
| Ultimate pressure |
5×10-4 Pa (2×10-5 Pa) | 5×10-4 Pa |
| Exhausting time (10min) |
7×10-3 Pa | 7×10-3 Pa |
| Exhausting operation |
Auto (full automatic) | Manual |
| Sputtering operation |
Manual (full automatic) | Manual |
| Power supply |
RF500W (DC1kW) | RF500W (DC1kW) |
| Temperature | 300°C | 300°C |
| Etching power source |
RF500W | RF500W |
| Size | 1250W×811D×1528H | 950W×860D×1540H |
