ACF System Flip Chip Bonder | SHIBATEC

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TFC-1000M/1000M-300

ACF System Flip Chip Bonder

Combined system of flip chip bonder TFC-1000 or 2000, ACF bonding equipment and final bonding equipment, to configure a mass production ACF line.

ACF bonding equipment
2 heads
Final bonding equipment
2 heads/unit
Combination of max. 4 units
Max. bonding load: 490N

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