TFC-2100C Flip Chip Bonder | SHIBATEC

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TFC-1000M/1000M-300

TFC-2100C Flip Chip Bonder

Carrier transfer type, high precision, high bonding load flip chip bonder

High productivity
Mounting tact time: 2.5 sec/point or higher
High precision
Precision of alignment: ±2.5µm or less
High bonding load
Maximum bonding load: 343N
Handles transfers of boards and individual substrates on a carrier (Max. width 120mm)
Supports ultrasonic bonding process

Ultrasonic bonding by flip chip bonder

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