TFC 2100 Flip Chip Bonder | SHIBATEC

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TFC-1000M/1000M-300

TFC 2100 Flip Chip Bonder

High precision, high bonding load flip chip bonder for COF, supporting reel feeding

High productivity
Mounting tact time: 2.5 sec/point or higher
High precision
Precision of alignment: ±2.5µm or less
High bonding load
Maximum bonding load: 343N
Supports ultrasonic bonding process

Ultrasonic bonding by flip chip bonder

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