TFC-1000m/1000M-300 Flip Chip Bonder | SHIBATEC

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TFC-1000M/1000M-300

TFC-1000m/1000M-300 Flip Chip Bonder

Full-automated flip chip bonder for BGA/CSP, for 300mm wafers

High productivity
Mounting tact time: 1.9 sec/point
High reliability
High precision bonding load control: 5 to 196N
High precision
Precision of alignment: ±10µm or less
Supports various bonding processes
Options support various bonding processes
Soldering process, ACF, NCP, ultrasonic, etc.

Ultrasonic bonding by flip chip bonder

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