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About Shibaura MechatronicsInvestor RelationsProducts Social and Environmental
Activities About Shibaura Mechatronics Investor RelationsProducts Social and Environmental
Activities
About Shibaura MechatronicsInvestor Relations Products Social and Environmental
Activities
Home > Products > Semiconductor Manufacturing Equipment > Die Bonders
High-speed epoxy die bonder for discrete devices
- High productivity: 0.2 sec/pce. cycle time by direct mounting method
- Digital bonding load setting die ejection mechanism
- Digital positioning of mount head achieves multiple die mounting
- Integrates programmable frame feeder
