FTD-1900/FED-1900 Die Bonder | SHIBATEC

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FTD-1780/FED-1780

FTD-1900/FED-1900

FTD-1900/FED-1900 Die Bonder

Die bonder for 300mm wafers
FTD-1900: 300mm wafer die bonder for DAF tape
FED-1900: 300mm wafer die bonder for epoxy bonding

Equipped with newly developed 300mm wafer unit
Achieves high-speed, high precision bonding with a precisor equipped with a picture recognition function
Applicable to both heated tape and epoxy bonding processes
Improved operability through adoption of large touch panel

Thin chip pick up

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