SHIBAURA
SHIBAURA MECHATRONICS CORPORATION

FTD-1780/FED-1780 Die Bonder

FTD-1780/FED-1780 Die Bonder

High-speed, high performance die bonder applicable to various devices such as the multi-stack CSP.
FTD-1780: 8-inch wafer die bonder for DAF tape
FED-1780: 8-inch wafer die bonder for epoxy bonding

Features

  • Achieves high-speed, high accuracy bonding to advanced packages (BGA, CSP) with a precisor equipped with a picture recognition function
  • Applicable to both heated tape and epoxy bonding processes
  • Die bonder for 6-inch wafer: FED-1760



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