High-speed, high performance die bonder applicable to various devices such as the multi-stack CSP.
FTD-1780: 8-inch wafer die bonder for DAF tape
FED-1780: 8-inch wafer die bonder for epoxy bonding
- Achieves high-speed, high accuracy bonding to advanced packages (BGA, CSP) with a precisor equipped with a picture recognition function
- Applicable to both heated tape and epoxy bonding processes
- Die bonder for 6-inch wafer: FED-1760