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About Shibaura MechatronicsInvestor RelationsProducts Social and Environmental
Activities About Shibaura Mechatronics Investor RelationsProducts Social and Environmental
Activities
About Shibaura MechatronicsInvestor Relations Products Social and Environmental
Activities
Home > Products > Semiconductor Manufacturing Equipment > Chemical
Dry Etching Equipment
Performs chemical dry etching of thin film on a semiconductor wafer in gaseous state (dry). Damage-free etching process through perfect separation of the etching unit and plasma generating unit enables wide use in the damage removal process.
- Microwave-based chemical dry etching
- Wafer temperature control
- Applicable to 8-inch wafers
- Enables rear face etching
- Transfer by double finger type robot
| Etching method | Microwave-utilized chemical dry etching |
|---|---|
| Etching material | Poly-Si, Si3N4,BPSG, W, Mo, Ta etc |
| Wafer size | Φ8"(OptionΦ6", Φ5") |
| Etching chamber | Single wafer |
| Vacuum pump | Dry pump |
| Pressure control | Conductance valve control |
| Etching gas | CF4, O2, N2 etc |
| Plasma power supply | Microwave 2. 45GHz 1. 0kW |
