Skip Header
About Shibaura Mechatronics Investor Relations Products Social and Environmental
Activities
About Shibaura MechatronicsInvestor RelationsProducts Social and Environmental
Activities About Shibaura Mechatronics Investor RelationsProducts Social and Environmental
Activities
About Shibaura MechatronicsInvestor Relations Products Social and Environmental
Activities
Home > Products > Media Device Manufacturing Equipment > Sputtering
Equipment for Master Disc Process
Dedicated sputtering equipment developed for forming Ni film of disc stamper.
- Operator-free fully automated operation
Continuous production is supported by connection of the developing machine and scalar robot for the stamper and a newly developed disk chuck mechanism with a highly accuracy door control mechanism - Space saving design
Saves space thanks to investigation of the parts layout at the design stage to enhance maintainability - Optimized balance system
Optimum system design gets maximum performance from the cryo-pump and DC power supply for sputtering, assuring quick evacuation by the small vacuum pump and highly efficient film sputtering
| Vacuum characteristics |
Ultimate pressure |
3 x 10-5 Pa |
|---|---|---|
| Pumping characteristics |
Within 5min to 2 x 10-5 Pa | |
| Sputtering characteristics |
Substrate dimensions |
Max. diameter Φ240 Max. thickness 6mm |
| Film thickness distribution |
Within ±5% (withinΦ120) | |
| Sputtering source |
5-inch (within Φ127) cathode x 1 unit DC500W | |
| Film forming speeds |
Ni 8 to 24nm/min | |
| Cycle time (reference value) | Stamper for disc 20min/disc (Condition: base pressure 2 × 10-3 Pa film thickness 50nm) |
|
