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SHIBAURA MECHATRONICS CORPORATION
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Semiconductor Manufacturing Equipment
Equipment name Type
Ion Chemical Etching Equipment ICE200/ICE300
Remote Plasma Ashing Equipment RPA300
Chemical Dry Etching Equipment CDE-80N
Resist Ashing Equipment µASH 8100W
Single Wafer Wet Cleaning Equipment SC Series/SC300i
Single Wafer Photo-mask Wet Cleaning Equipment MC225
Automatic Wafer Edge Inspection Equipment EI-12
Automatic Wafer Surface Inspection Equipment AI-12
Die Bonders FTD-1780/FED-1780
FTD-1900/FED-1900
FED-1711S
Flip Chip Bonders TFC-900
TFC-1000M/1000M-300
TFC-2100
TFC-2100C
ACF SYSTEM
Inner Lead Bonders TTI-810

Media Device Manufacturing Equipment
Equipment name Type
Single Layer Sputtering Equipment Stella Series
Multi-layer Sputtering Equipment OCTAVA Series
Vacuum Bonding Equipment Cielo Series
Sputtering Equipment for Master Disc Process CDS-6PH



Other Equipment
Equipment name Type
Microwave Heating Equipment  
Microwave Plasma Processing Equipment  
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